3d Ic Trends PDF Book

Author : Lih-Tyng Hwang,Tzyy-Sheng Jason Horng
Publisher : John Wiley & Sons
Release : 2018-03-28
Category : Technology & Engineering
ISBN : 9781119289678
File Size : 43,9 Mb
Total Download : 702

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Book Summary: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Author : Vinit Kumar Gunjan,Jacek M. Zurada
Publisher : Springer Nature
Release : 2023-02-23
Category : Technology & Engineering
ISBN : 9789811960888
File Size : 29,8 Mb
Total Download : 157

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Book Summary: The book is a collection of best selected research papers presented at the International Conference on Recent Trends in Machine Learning, IoT, Smart Cities and Applications (ICMISC 2022) held during 28 – 29 March 2022 at CMR Institute of Technology, Hyderabad, Telangana, India. This book will contain the articles on current trends of machine learning, internet of things, and smart cities applications emphasizing on multi-disciplinary research in the area of artificial intelligence and cyber physical systems. The book is a great resource for scientists, research scholars and PG students to formulate their research ideas and find the future directions in these areas. Further, this book serves as a reference work to understand the latest technologies by practice engineers across the globe.

Author : Solanki, Arun,Kumar, Sandeep,Nayyar, Anand
Publisher : IGI Global
Release : 2019-12-13
Category : Computers
ISBN : 9781522596455
File Size : 20,8 Mb
Total Download : 378

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Book Summary: As today’s world continues to advance, Artificial Intelligence (AI) is a field that has become a staple of technological development and led to the advancement of numerous professional industries. An application within AI that has gained attention is machine learning. Machine learning uses statistical techniques and algorithms to give computer systems the ability to understand and its popularity has circulated through many trades. Understanding this technology and its countless implementations is pivotal for scientists and researchers across the world. The Handbook of Research on Emerging Trends and Applications of Machine Learning provides a high-level understanding of various machine learning algorithms along with modern tools and techniques using Artificial Intelligence. In addition, this book explores the critical role that machine learning plays in a variety of professional fields including healthcare, business, and computer science. While highlighting topics including image processing, predictive analytics, and smart grid management, this book is ideally designed for developers, data scientists, business analysts, information architects, finance agents, healthcare professionals, researchers, retail traders, professors, and graduate students seeking current research on the benefits, implementations, and trends of machine learning.

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
Release : 2012-11-27
Category : Technology & Engineering
ISBN : 9781441995421
File Size : 46,8 Mb
Total Download : 379

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Book Summary: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
Publisher : Springer
Release : 2014-08-21
Category : Technology & Engineering
ISBN : 9783319076119
File Size : 46,8 Mb
Total Download : 191

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Book Summary: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Author : Kazuo Kondo,Morihiro Kada,Kenji Takahashi
Publisher : Springer
Release : 2015-12-09
Category : Science
ISBN : 9783319186757
File Size : 38,9 Mb
Total Download : 367

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Book Summary: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Author : Rohit Sharma
Publisher : CRC Press
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 9781466589421
File Size : 14,9 Mb
Total Download : 543

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Book Summary: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Hong Xiao
Publisher : Spie Society of Photo-Optical Instrumentation Engineers (Spie
Release : 2016-04
Category : Three-dimensional integrated circuits
ISBN : 1510601465
File Size : 43,9 Mb
Total Download : 613

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Book Summary: This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.